The thermal calculation, using FEM simulation is useful for various applications. We perform the thermal calculation for the following questions for our customers

- Temperature calculation to determine the component stress
- Calculation of the temperature distribution in electronic components
- Simulation of the heat treatment of components
- Simulation of the temperature distribution as a result of the manufacturing process

**Temperature calculation to determine the component stress**

For many machines, the load variables relevant to dimensioning are the stresses resulting from thermal loads, such as those occurring during the start-up and shut-down processes of gas turbines and heat exchangers. Knowledge of the transient temperature field also plays an important role in small components such as injection nozzles of injection molding machines.

**Calculation of the temperature distribution in electronic components**

The ANSYS Icepak simulation program offers the possibility of a coupled simulation of thermal and fluid mechanics to calculate the temperature distribution when operating circuit boards, measuring devices or optical devices. In this way, we can efficiently and cost-effectively determine the heat development and heat dissipation for example due to fans of your electronic components.

**Simulation of the heat treatment of components**

The heat treatment setup can be optimized by simulating the heat treatment, for example for the local stress-relief annealing of welded seams by means of inductive processes. The process can thus be performed safely and efficiently.

**Simulation of the temperature distribution due to the manufacturing process**

In additive manufacturing, the temperature development due to the manufacturing process plays an important role, as this leads to deformation of the components. A thermal simulation can be used to optimize the geometry and the support structure. This leads to an increase of the accuracy of fit of the components.

We have many years of experience in carrying out stationary and transient temperature field calculations for various industries and components. For a realistic result of the FEM simulation, temperature-dependent material data is taken into account. The necessary heat transfer coefficients can be taken from the literature, from regulations or determined with the help of supporting flow simulations ensure a realistic boundary condition to the environment. In the same way as with control engineering, PID controllers can be considered in a thermal calculation for heated or cooled component areas.

If significant temperature changes occur due to the mechanical behavior, a coupled thermomechanical simulation can also be performed. This can be useful if, for example mechanical energy is converted into heat by friction or large strains.

**You might also be interested in the following pages:**

Static calculation with load due to temperature

Strength verification, improved results due to knowledge of the component temperature

Simulation of heat treatment of components